Dell unveils open rack-scale AI systems with 60% cooling savings
Dell Technologies has presented new open, modular infrastructure designs focused on enhancing scalability, efficiency, and management for enterprise AI workloads.
The introduction of Dell's IR7000 rack, designed according to Open Compute Project (OCP) standards, demonstrates the company's focus on providing production-ready systems capable of managing intensive AI applications. The IR7000 is described as being equipped to address current challenges in compute density, power efficiency, and cooling within data centres.
Rack-scale systems
Central to Dell's proposition are its Integrated Rack Scalable Systems (IRSS), configured as turnkey rack-scale solutions for AI and high-performance computing (HPC) needs. The IRSS range is aligned with OCP's Open Rack V3 and DC-MHS standards, aiming to streamline deployment and reduce integration risks.
According to Dell, the IR7000 racks benefit from factory validation, with single-vendor support and optional data centre assessment to help customers accelerate operations while reducing the complexity often associated with multi-vendor deployments. These solutions include adaptability for future compute sleds and up to 480kW of power, extending their operational lifespan as AI demands evolve.
The company highlights several features intended to simplify deployment, including a patented AC whip design, a 750mm-wide form factor, and a strain relief bar to aid cable management. The IR9000 series, another addition, extends Open Rack V3's design to accommodate 19" rack sleds tailored for high-performance systems, such as the PowerEdge XE9712 equipped with NVIDIA GB300 NVL72 GPUs.
Cooling breakthroughs
Addressing power and thermal management, Dell has introduced the PowerCool Enclosed Rear Door Heat Exchanger (eRDHx), which the company describes as an industry-first for OCP version 3 (ORv3) systems. This unit is designed to capture 100% of IT heat and operate at so-called room-neutral temperatures.
Save up to 60% on cooling costs with PowerCool eRDHx-more than cooling, it's how to run more AI and HPC compute in the same footprint with greater efficiency.
The eRDHx solution is claimed to reduce cooling energy consumption by as much as 60% when utilised with Dell's IR7000 racks and integrated hybrid direct liquid cooling (DLC). Enabling operation with warmer water temperatures between 32°C and 36°C, it reduces reliance on traditional chillers while cutting operational expenses.
To complement its cooling technology, Dell offers the Integrated Rack Controller (IRC) together with OpenManage Enterprise (OME). This centralised management prepares the infrastructure for real-time monitoring and data-driven insights, promoting operational efficiency and risk mitigation at rack-level granularity.
Optics for AI networking
On the networking side, Dell has released details on its Linear Pluggable Optics (LPO), which eliminates the Digital Signal Processor (DSP) chip commonly found in optical transceivers and instead leverages the host platform's DSP. LPOs are designed to support 400GbE and 800GbE, allowing gradual upgrade paths for customers.
Optimised for lower power, cost, and latency, Dell Linear Pluggable Optics is a Digital Signal Processor-free optical solution for modern networking. Dell LPO eliminates the Digital Signal Processor (DSP) chip, using the host platform's DSP instead. The result: Lower Power draw and 50% lower consumption: 2-4W for 400GbE vs. 7-9W for traditional optics, and up to 50% lower transceiver power consumption. Lower Cost: LPOs cut the DSP chip, lowering costs for hyperscale GenAI and boosting supply options. Lower Latency: Optimised for real-time AI and HPC workloads.
Integrated with Dell PowerSwitch Ethernet and Broadcom Thor 2 NICs, the LPO solution is designed to provide power savings, lower total cost, and reduced latency critical for AI and HPC use cases.
Commitment to open standards
Dell reiterated its commitment to open, standards-based architectures and highlighted the role of OCP in evolving the data centre landscape through openness and efficiency. The company positions itself as offering infrastructure that is not only OCP-aligned but is also equipped to handle future requirements while delivering enterprise-grade support and deployment capabilities.
Dell is committed to delivering open standards-based infrastructure, made enterprise ready to deliver value to our customers
The company stated its approach includes open modular hardware, proven cooling for dense AI deployments, and support infrastructure tailored for large-scale, real-world enterprise scenarios.
Open standards matter. Efficiency matters. Time-to-value matters. With Dell's latest innovations in rackscale, power and cooling with PowerCool eRDHx, and Networking with LPO, Dell shows at OCP Summit 2025 that customers don't have to choose-they can have all three, delivered today.
With these announcements, Dell emphasised the value of combining open standards, operational efficiency, and accelerated deployment in a single enterprise-ready offering for AI and data centre operators.
